By Gordon Roberts, Friedrich Taenzler, Mark Burns
Built-in circuits incorporating either electronic and analog capabilities became more and more known within the semiconductor undefined. Mixed-signal IC try out and size has grown right into a hugely really expert box of electric engineering. in spite of the fact that, try engineering continues to be a comparatively unknown career in comparison to IC layout engineering.
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Additional info for An Introduction to Mixed-Signal Test and Measurement
Lead frames are punched metal holders that eventually become the individual leads of the packaged device. Bond wires are attached from each die's bond pads to the appropriate lead of the lead frame. Then plastic is injection-molded around the dies and lead frame to fonn packaged devices. Finally, the individual packaged devices are separatedfrom one another by trimming them from the lead frame. After the leadshavebeentrimmed and formed,the devicesare ready for final testingon a secondATE tester.
0" W I c > 0" W I c > 10 10 10 10 100 - f 1 k TOTAL 10k - Frequency Figure 100 100k 61 HARMONIC DISTORTION IDk 100k . 04 c 0 c .. n c 0 3 . E = : ,2 - Hz TLOS1 UNITY-GAIN 1 2 Frequ ency Figure FREQUENCY . 1 k - f Hz vs .. VOLTAGE FREQUENCY N l! 8 CL-25pF TA=25"C See Figure 2. 7 D 2 '-Frequency-Hz Figure 4 6 8 1D IVCCtl-SupplyVolfage-V 63 Figure 64 . . 7. OffIce Low-offset 50X """, JFET DALLAS. 'EXA5 op amp: 7526S characterization data. 12 14 4 16 Chapter 2 . "cification Process 35 Similarly, test hardware such as DIBs and probe interface hardware cannot be properly designeduntil all test details are known.
The test engineer must determine which answer is correct and why there is a discrepancy. It is also common to find that two supposedly identical testers or DIB boards give different answers or that the same tester gives different answers from day to day. These problems frequently result from obscure hardware or software errors that may take days to isolate. Correlation efforts can representa major portion of the time spent debugging a test program. 3 Electromechanical Fixturing Challenges The test head and DlB board must ultimately make contact to the DUT through the handler or prober.
An Introduction to Mixed-Signal Test and Measurement by Gordon Roberts, Friedrich Taenzler, Mark Burns